LINCOLN, R.I. -- The Solder Paste Group of EFD, Inc. and Leister Technologies LLC have agreed to a cooperative marketing effort for a unique, high-speed, high-precision, automated solder paste reflow system designed to substantially increase production yields and deliver greater throughput. Among its many advantages, the times savings alone with the EFD/Leister package could reach 80% or more over traditional wire and iron soldering methods.
Improved tip temperature regulation is critical, both during soldering and when idle, to prevent the tip attaining excessive temperatures. In fact, reliable Pb-free solder joints can be formed, at commercially acceptable wetting speed, without increasing the tip temperature above the levels established for SnPb soldering.Except for historical information and comparisons contained herein, statements included in this release may constitute "forward-looking statements," as defined by The Private Securities Litigation Reform Act of 1995. These statements involve a number of risks, uncertainties and other factors, as discussed in the company's filings with the Securities and Exchange Commission that could cause actual results to differ.For an inductively heated soldering iron, this can be achieved by the use of a sleeper stand to park the soldering iron when idle (Figure 2). A sleeper stand uses passive techniques, transparent to the operator, to partially reduce the inductive heating effect and bring down the temperature to around 149[degrees]C during idling. As Figure 3 shows, this reduced idle temperature is below the active temperature range of the Pb-free flux, which prevents the flux from damaging the tip coating. Flux charring, which occurs during idle, is also eradicated, eliminating the need to clean the tip directly after withdrawing the iron from the stand.An inductive heating technology, tailored for soldering irons, naturally limits the maximum temperature of the tip, without requiring temperature sensing or control circuitry. It also responds automatically and quickly to maintain the tip temperature when the thermal load is applied.Multiple nozzle sizes are included for precise focus of hot air for localized reflow from 100 xC to 480 xC adjustable in 1xC increments allowing for reflow without overheating components. The ProcessMate 6100 is easy to set up and operators are able to visually observe solder being reflowed to prevent common soldering defects. For more information, contact EFD at 800-338-4353, 401-333-3800, or visit www.efdsolder.com.Most soldering irons have a ceramic heater embedded in the main body of the hand-piece, with a temperature sensor located between the heater and tip. Sensor output is detected to control the ceramic heater temperature and thereby maintain constant tip temperature. However, it is not practical to locate the temperature sensor at the point where the soldering iron makes contact with the work-piece. As a result, the heater controller does not respond to the actual tip temperature, and this introduces an unavoidable lag in the system. When the controller receives the signal to turn on the heater, the tip temperature will have already fallen below the optimum soldering temperature. Then, when the heater is turned on, the tip temperature will overshoot the desired setpoint before the sensor indicates the heater should be turned off. This overshoot accelerates the aggressive tip erosion mechanisms and also has the potential to exceed the soldering process window, thereby incurring damage to the component or pad.Keith Wheeler, General Manager of EFD Solder Paste Group explains, "EFD, Inc. Solder Paste Group is constantly striving to satisfy our customers' needs to produce good solder joints consistently. To do so, we need to provide the total soldering solution starting with quality solder paste formulations coupled with EFD's precision dispensing components and equipment and with the addition of our new hot air reflow system we have the ability to satisfy that need."Applying thicker plating to the copper tip will, naturally, extend its life. However, undesirable effects include reduced thermal conductivity of the path from the copper core to the soldering site, causing a reduction in productivity. A thicker plating will also tend to increase the size of the tip, which is not compatible with modern fine-pitch interconnects, tight component spacing and small pad dimensions. The challenge must be met at a more fundamental level.
For more information on the EFD/Leister Tabletop Laser Soldering System Package, visit www.efdsolder.com or www.leisterlaser.com.
No comments:
Post a Comment